"Von der Idee zum Prototypen“: Entwicklung eines modularen NFC-basierten Sensormoduls für industrielle Anwendungen

Abstract

This paper examines the extent to which a miniaturized and modular sensor module is technically feasible and practical for use in metal-rich environments. The focus is on a hybrid transmission approach that combines two complementary paths: On the one hand, energy and data are transmitted via near-field coupling at 13.56 MHz using integrated Near Field Communication (NFC) components and I²C sensor connection. On the other hand, acoustic signal transmission via piezo elements is used to send data through or along metallic structures. The first part of the thesis provided theoretical foundations for product development, NFC, and Piazzo elements, on the basis of which the prototype was developed. In addition to functional verification, the work aims to derive viable procedures for prototype construction, testing, and near-series validation steps in small batches. Methodologically, the entire development process is mapped: from the system architecture with cubeshaped module design to the ECAD-supported layout in KiCAD to the industrial production of the printed circuit boards in Electroless Nickel Immersion Gold (ENIG) finish, taking into account common design rules. Assembly is carried out manually under a microscope using hot plate reflow technology in an ESD-safe environment. Existing reader/demo software is available for commissioning. In addition, optical tests, basic electrical checks (power supply, I²C communication), and modular integration and functional tests are carried out under application-oriented conditions. The results confirm the functionality of the overall system. The integrated MEMS temperature sensor can be reliably read out via the NFC transponder. The interaction between protocol control, energy transfer, and coding is stable and reproducible in the prototype. Concrete recommendations for subsequent development phases can be derived from the experience gained: Mechanically, CNC-machined components and internal 90° solder connections offer greater stability and better use of installation space. Thermally, there is an advantage in placing energy-intensive paths away from the sensor. With regard to acoustic coupling, a standardized, quality-assured bonding process is essential. Clear parameter control for gap dimensions, force distribution, and curing must also be observed.

Date of Award	2025
Original language	German (Austria)
Supervisor	Franz Obermair (Supervisor)