TY - JOUR
T1 - Surfing Virtual Waves to Thermal Tomography
T2 - From model-to deep learning-based reconstructions
AU - Kovacs, Peter
AU - Lehner, Bernhard
AU - Thummerer, Gregor
AU - Mayr, Gunther
AU - Burgholzer, Peter
AU - Huemer, Mario
N1 - Funding Information:
This work was supported by Silicon Austria Labs (SAL), owned by the Republic of Austria; the Styrian Business Promotion Agency (SFG), the federal state of Carinthia; Upper Austrian Research; the Austrian Association for the Electric and Electronics Industry; the "University SAL Labs" initiative of SAL and its Austrian partner universities; and the Competence Centers for Excellent Technologies (COMETK2) "Center for Symbiotic Mechatronics" of the Linz Center of Mechatronics, funded by the Austrian Federal Government and the federal state of Upper Austria. Financial support by the Austrian Federal Ministry for Digital and Economic Affairs; National Foundation for Research, Technology, and Development; and Christian Doppler Research Association is gratefully acknowledged. Financial support was also provided by the Austrian Research Funding Association within the scope of the COMET program within the research project "Photonic Sensing for Smarter Processes" (contract 871974). This program is promoted by the Federal Ministry for Climate Action, Environment, Energy, Mobility, Innovation and Technology (BMK); Federal Ministry for Digital and Economic Affairs (BMDW); the federal state of Upper Austria; and the federal state of Styria, represented by the SFG. Additionally, parts of this work were supported by the Austrian Science Fund (projects 30747-N32 and P 33019-N). The project was also supported by the ÚNKP-21-5 New National Excellence Program of the Ministry for Innovation and Technology from the source of the National Research, Development, and Innovation Fund. Péter Kovács and Bernhard Lehner contributed equally to this work, and both should be considered first authors of this article.
Publisher Copyright:
© 2021 IEEE.
PY - 2022/1/1
Y1 - 2022/1/1
N2 - Thermographic imaging is a fast and contactless way of inspecting material parts. Usually, with model-driven evaluation procedures, lateral heat flow is ignored, and, thus, 1D reconstruction is applied to detect defects. However, to correctly size defects, the lateral heat flow must be considered, which requires a full 3D reconstruction. The 3D thermal defect imaging is a major challenge because heat propagation is an irreversible process. The virtual wave concept (VWC) is a recently developed method that considers both lateral and axial heat flows and, therefore, allows multidimensional reconstruction at improved spatial resolution. This approach decomposes the problem into two steps; can be used for 1D, 2D, and 3D heat conduction problems; and provides new alternatives to using physical priors (e.g., nonnegativity and/or sparsity), all of which improve reconstruction accuracy at a relatively low computational cost.
AB - Thermographic imaging is a fast and contactless way of inspecting material parts. Usually, with model-driven evaluation procedures, lateral heat flow is ignored, and, thus, 1D reconstruction is applied to detect defects. However, to correctly size defects, the lateral heat flow must be considered, which requires a full 3D reconstruction. The 3D thermal defect imaging is a major challenge because heat propagation is an irreversible process. The virtual wave concept (VWC) is a recently developed method that considers both lateral and axial heat flows and, therefore, allows multidimensional reconstruction at improved spatial resolution. This approach decomposes the problem into two steps; can be used for 1D, 2D, and 3D heat conduction problems; and provides new alternatives to using physical priors (e.g., nonnegativity and/or sparsity), all of which improve reconstruction accuracy at a relatively low computational cost.
UR - http://www.scopus.com/inward/record.url?scp=85122467249&partnerID=8YFLogxK
U2 - 10.1109/MSP.2021.3120978
DO - 10.1109/MSP.2021.3120978
M3 - Article
AN - SCOPUS:85122467249
SN - 1053-5888
VL - 39
SP - 55
EP - 67
JO - IEEE Signal Processing Magazine
JF - IEEE Signal Processing Magazine
IS - 1
ER -