NON-DESTRUCTIVE INSPECTION OF THERMOELECTRIC MODULES BY SCANNING ACOUSTIC MICROSCOPY

K. H. Gresslehner; M. Krenn; P. Kerepesi; L. Gupfinger; M. Höglinger; P. Zellinger; B. Plank; Ch Beisteiner

doi:10.63527/1607-8829-2024-4-26-33

NON-DESTRUCTIVE INSPECTION OF THERMOELECTRIC MODULES BY SCANNING ACOUSTIC MICROSCOPY

K. H. Gresslehner, M. Krenn, P. Kerepesi, L. Gupfinger, M. Höglinger, P. Zellinger, B. Plank, Ch Beisteiner

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Abstract

In this work we present the potential of Scanning Acoustic Microscopy (SAM) as an important non-destructive evaluation (NDE) method for process control as well as failure analysis of thermoelectric modules (TE-modules). SAM is one part of the so called ‘Dream Team Concept’ which is described in detail in section 2.

Original language	English
Pages (from-to)	26-33
Number of pages	8
Journal	Journal of Thermoelectricity
Volume	2024
Issue number	4
DOIs	https://doi.org/10.63527/1607-8829-2024-4-26-33
Publication status	Published - 25 Dec 2024

Keywords

non-destructive inspection
scanning acoustic microscopy
thermoelectric modules

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10.63527/1607-8829-2024-4-26-33

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AU - Gresslehner, K. H.

AU - Krenn, M.

AU - Kerepesi, P.

AU - Gupfinger, L.

AU - Höglinger, M.

AU - Zellinger, P.

AU - Plank, B.

AU - Beisteiner, Ch

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AB - In this work we present the potential of Scanning Acoustic Microscopy (SAM) as an important non-destructive evaluation (NDE) method for process control as well as failure analysis of thermoelectric modules (TE-modules). SAM is one part of the so called ‘Dream Team Concept’ which is described in detail in section 2.

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KW - scanning acoustic microscopy

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NON-DESTRUCTIVE INSPECTION OF THERMOELECTRIC MODULES BY SCANNING ACOUSTIC MICROSCOPY

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Keywords

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