Non-Destructive Inspection of Thermoelectric Modules by Infrared-Thermography

Thermoelectric modules (TE-modules) are pivotal in converting thermal energy into electrical energy through the Seebeck effect or vice versa via the Peltier effect. These solid-state devices offer numerous advantages, including no moving parts, low maintenance, and long lifespan. However, their reliability and performance are highly dependent on the quality of thermoelement junctions.

This study focuses on the non-destructive evaluation (NDE) of TE-modules using infrared thermography (IR-Th). The research highlights the importance of reliability engineering in transitioning thermoelectricity from lab-scale to industrial applications. Various NDE methods, collectively referred to as the 'Dream Team concept,' are employed to detect and analyze defects in TE-modules. These methods include AC resistance measurement as a function of temperature (ACR vs. T), IR-Th, Scanning Acoustic Microscopy (SAM), and X-ray Tomography (XCT).

The findings demonstrate that these NDE techniques are effective in identifying both 'weak' and 'hard' failures in TE-modules, which are crucial for ensuring long-term stability and performance. The study also underscores the significance of combining NDE with destructive evaluation (DE) methods for comprehensive failure analysis.

The results of this research contribute to the advancement of process and product control in the manufacturing of TE-modules, facilitating their reliable application in various industrial settings.