Comparative Analysis of SRAM PUF Temperature Susceptibility on Embedded Systems

Martina Zeinzinger; Josef Langer; Florian Eibensteiner; Phillip Petz; Lucas Drack; Daniel Dorfmeister; Rudolf Ramler

doi:10.1109/ICECET58911.2023.10389242

Comparative Analysis of SRAM PUF Temperature Susceptibility on Embedded Systems

Martina Zeinzinger
, Josef Langer
, Florian Eibensteiner
, Phillip Petz
, Lucas Drack
, Daniel Dorfmeister
, Rudolf Ramler

Research output: Chapter in Book/Report/Conference proceedings › Conference contribution › peer-review

4 Citations (Scopus)

Abstract

An SRAM Physical Unclonable Function (PUF) can distinguish SRAM modules by analyzing the inherent randomness of their start-up behavior. However, the effectiveness of this technique varies depending on the design and fabrication of the SRAM module. This study compares two similar microcontrollers, both equipped with on-chip SRAM, to determine which device produces a better SRAM PUF. Both microcontrollers are programmed with an identical SRAM PUF authentication routine and tested under varying ambient temperatures (ranging from 10 °C to 50 °C) to evaluate the impact of temperature on SRAM PUF performance. One embedded SRAM works significantly better than the other, even though the two models are closely related. The presented results can be used early in the design process to compare arbitrary on-chip SRAM models and see which is best suited for implementing an SRAM PUF.

Original language	English
Title of host publication	International Conference on Electrical, Computer and Energy Technologies, ICECET 2023
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9798350327816
DOIs	https://doi.org/10.1109/ICECET58911.2023.10389242
Publication status	Published - 2023
Event	2023 IEEE International Conference on Electrical, Computer and Energy Technologies, ICECET 2023 - Cape Town, South Africa Duration: 16 Nov 2023 → 17 Nov 2023

Publication series

Name	International Conference on Electrical, Computer and Energy Technologies, ICECET 2023

Conference

Conference	2023 IEEE International Conference on Electrical, Computer and Energy Technologies, ICECET 2023
Country/Territory	South Africa
City	Cape Town
Period	16.11.2023 → 17.11.2023

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 7 Affordable and Clean Energy

Keywords

chip biometrics
embedded systems
fuzzy extractor
hardware authentication
SRAM PUF
temperature

Access to Document

10.1109/ICECET58911.2023.10389242

Cite this

Zeinzinger, M., Langer, J., Eibensteiner, F., Petz, P., Drack, L., Dorfmeister, D., & Ramler, R. (2023). Comparative Analysis of SRAM PUF Temperature Susceptibility on Embedded Systems. In International Conference on Electrical, Computer and Energy Technologies, ICECET 2023 (International Conference on Electrical, Computer and Energy Technologies, ICECET 2023). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICECET58911.2023.10389242

Zeinzinger, Martina ; Langer, Josef ; Eibensteiner, Florian et al. / Comparative Analysis of SRAM PUF Temperature Susceptibility on Embedded Systems. International Conference on Electrical, Computer and Energy Technologies, ICECET 2023. Institute of Electrical and Electronics Engineers Inc., 2023. (International Conference on Electrical, Computer and Energy Technologies, ICECET 2023).

@inproceedings{b62f48725e0745819fa6500294cca703,

title = "Comparative Analysis of SRAM PUF Temperature Susceptibility on Embedded Systems",

abstract = "An SRAM Physical Unclonable Function (PUF) can distinguish SRAM modules by analyzing the inherent randomness of their start-up behavior. However, the effectiveness of this technique varies depending on the design and fabrication of the SRAM module. This study compares two similar microcontrollers, both equipped with on-chip SRAM, to determine which device produces a better SRAM PUF. Both microcontrollers are programmed with an identical SRAM PUF authentication routine and tested under varying ambient temperatures (ranging from 10 °C to 50 °C) to evaluate the impact of temperature on SRAM PUF performance. One embedded SRAM works significantly better than the other, even though the two models are closely related. The presented results can be used early in the design process to compare arbitrary on-chip SRAM models and see which is best suited for implementing an SRAM PUF.",

keywords = "chip biometrics, embedded systems, fuzzy extractor, hardware authentication, SRAM PUF, temperature",

author = "Martina Zeinzinger and Josef Langer and Florian Eibensteiner and Phillip Petz and Lucas Drack and Daniel Dorfmeister and Rudolf Ramler",

note = "Publisher Copyright: {\textcopyright} 2023 IEEE.; 2023 IEEE International Conference on Electrical, Computer and Energy Technologies, ICECET 2023 ; Conference date: 16-11-2023 Through 17-11-2023",

year = "2023",

doi = "10.1109/ICECET58911.2023.10389242",

language = "English",

series = "International Conference on Electrical, Computer and Energy Technologies, ICECET 2023",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "International Conference on Electrical, Computer and Energy Technologies, ICECET 2023",

address = "United States",

}

Zeinzinger, M , Langer, J , Eibensteiner, F , Petz, P, Drack, L, Dorfmeister, D & Ramler, R 2023, Comparative Analysis of SRAM PUF Temperature Susceptibility on Embedded Systems. in International Conference on Electrical, Computer and Energy Technologies, ICECET 2023. International Conference on Electrical, Computer and Energy Technologies, ICECET 2023, Institute of Electrical and Electronics Engineers Inc., 2023 IEEE International Conference on Electrical, Computer and Energy Technologies, ICECET 2023, Cape Town, South Africa, 16.11.2023. https://doi.org/10.1109/ICECET58911.2023.10389242

Comparative Analysis of SRAM PUF Temperature Susceptibility on Embedded Systems. / Zeinzinger, Martina ; Langer, Josef ; Eibensteiner, Florian et al.
International Conference on Electrical, Computer and Energy Technologies, ICECET 2023. Institute of Electrical and Electronics Engineers Inc., 2023. (International Conference on Electrical, Computer and Energy Technologies, ICECET 2023).

Research output: Chapter in Book/Report/Conference proceedings › Conference contribution › peer-review

TY - GEN

T1 - Comparative Analysis of SRAM PUF Temperature Susceptibility on Embedded Systems

AU - Zeinzinger, Martina

AU - Langer, Josef

AU - Eibensteiner, Florian

AU - Petz, Phillip

AU - Drack, Lucas

AU - Dorfmeister, Daniel

AU - Ramler, Rudolf

PY - 2023

Y1 - 2023

N2 - An SRAM Physical Unclonable Function (PUF) can distinguish SRAM modules by analyzing the inherent randomness of their start-up behavior. However, the effectiveness of this technique varies depending on the design and fabrication of the SRAM module. This study compares two similar microcontrollers, both equipped with on-chip SRAM, to determine which device produces a better SRAM PUF. Both microcontrollers are programmed with an identical SRAM PUF authentication routine and tested under varying ambient temperatures (ranging from 10 °C to 50 °C) to evaluate the impact of temperature on SRAM PUF performance. One embedded SRAM works significantly better than the other, even though the two models are closely related. The presented results can be used early in the design process to compare arbitrary on-chip SRAM models and see which is best suited for implementing an SRAM PUF.

AB - An SRAM Physical Unclonable Function (PUF) can distinguish SRAM modules by analyzing the inherent randomness of their start-up behavior. However, the effectiveness of this technique varies depending on the design and fabrication of the SRAM module. This study compares two similar microcontrollers, both equipped with on-chip SRAM, to determine which device produces a better SRAM PUF. Both microcontrollers are programmed with an identical SRAM PUF authentication routine and tested under varying ambient temperatures (ranging from 10 °C to 50 °C) to evaluate the impact of temperature on SRAM PUF performance. One embedded SRAM works significantly better than the other, even though the two models are closely related. The presented results can be used early in the design process to compare arbitrary on-chip SRAM models and see which is best suited for implementing an SRAM PUF.

KW - chip biometrics

KW - embedded systems

KW - fuzzy extractor

KW - hardware authentication

KW - SRAM PUF

KW - temperature

UR - https://www.scopus.com/pages/publications/85187253983

U2 - 10.1109/ICECET58911.2023.10389242

DO - 10.1109/ICECET58911.2023.10389242

M3 - Conference contribution

AN - SCOPUS:85187253983

T3 - International Conference on Electrical, Computer and Energy Technologies, ICECET 2023

BT - International Conference on Electrical, Computer and Energy Technologies, ICECET 2023

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2023 IEEE International Conference on Electrical, Computer and Energy Technologies, ICECET 2023

Y2 - 16 November 2023 through 17 November 2023

ER -

Zeinzinger M , Langer J , Eibensteiner F , Petz P, Drack L, Dorfmeister D et al. Comparative Analysis of SRAM PUF Temperature Susceptibility on Embedded Systems. In International Conference on Electrical, Computer and Energy Technologies, ICECET 2023. Institute of Electrical and Electronics Engineers Inc. 2023. (International Conference on Electrical, Computer and Energy Technologies, ICECET 2023). doi: 10.1109/ICECET58911.2023.10389242

Comparative Analysis of SRAM PUF Temperature Susceptibility on Embedded Systems

Abstract

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UN SDGs

Keywords

Access to Document

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