NON-DESTRUCTIVE INSPECTION OF THERMOELECTRIC MODULES BY SCANNING ACOUSTIC MICROSCOPY

K. H. Gresslehner; M. Krenn; P. Kerepesi; L. Gupfinger; M. Höglinger; P. Zellinger; B. Plank; Ch Beisteiner

doi:10.63527/1607-8829-2024-4-26-33

NON-DESTRUCTIVE INSPECTION OF THERMOELECTRIC MODULES BY SCANNING ACOUSTIC MICROSCOPY

K. H. Gresslehner
, M. Krenn
, P. Kerepesi
, L. Gupfinger
, M. Höglinger
, P. Zellinger
, B. Plank
, Ch Beisteiner

Research Center Wels

Publikation: Beitrag in Fachzeitschrift › Artikel › Begutachtung

3 Zitate (Scopus)

Abstract

In this work we present the potential of Scanning Acoustic Microscopy (SAM) as an important non-destructive evaluation (NDE) method for process control as well as failure analysis of thermoelectric modules (TE-modules). SAM is one part of the so called ‘Dream Team Concept’ which is described in detail in section 2.

Originalsprache	Englisch
Seiten (von - bis)	26-33
Seitenumfang	8
Fachzeitschrift	Journal of Thermoelectricity
Jahrgang	2024
Ausgabenummer	4
DOIs	https://doi.org/10.63527/1607-8829-2024-4-26-33
Publikationsstatus	Veröffentlicht - 25 Dez. 2024

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10.63527/1607-8829-2024-4-26-33

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author = "Gresslehner, \{K. H.\} and M. Krenn and P. Kerepesi and L. Gupfinger and M. H{\"o}glinger and P. Zellinger and B. Plank and Ch Beisteiner",

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AU - Gresslehner, K. H.

AU - Krenn, M.

AU - Kerepesi, P.

AU - Gupfinger, L.

AU - Höglinger, M.

AU - Zellinger, P.

AU - Plank, B.

AU - Beisteiner, Ch

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N2 - In this work we present the potential of Scanning Acoustic Microscopy (SAM) as an important non-destructive evaluation (NDE) method for process control as well as failure analysis of thermoelectric modules (TE-modules). SAM is one part of the so called ‘Dream Team Concept’ which is described in detail in section 2.

AB - In this work we present the potential of Scanning Acoustic Microscopy (SAM) as an important non-destructive evaluation (NDE) method for process control as well as failure analysis of thermoelectric modules (TE-modules). SAM is one part of the so called ‘Dream Team Concept’ which is described in detail in section 2.

KW - non-destructive inspection

KW - scanning acoustic microscopy

KW - thermoelectric modules

UR - https://www.scopus.com/pages/publications/105003663607

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DO - 10.63527/1607-8829-2024-4-26-33

M3 - Article

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SN - 1607-8829

VL - 2024

SP - 26

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JO - Journal of Thermoelectricity

JF - Journal of Thermoelectricity

IS - 4

ER -

NON-DESTRUCTIVE INSPECTION OF THERMOELECTRIC MODULES BY SCANNING ACOUSTIC MICROSCOPY

Abstract

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