TY - GEN
T1 - Heatsink design for optimal thermal management
AU - Hofinger, Daniel
AU - Jungwirth, Mario
PY - 2011
Y1 - 2011
N2 - Increasing power density in power electronics applications requires optimum design of the cooling system. Finding the optimum design by manufacturing prototypes is often difficult, time consuming and expensive due to the large number of variable parameters. The choice of the optimal heat sink-fan combination can be assisted by a number of different numerical simulation methods. In a case study of a typical heat sink-fan combination in a welding machine, a comparison is presented between a full CFD-simulation and an optimization routine, embedded in a Matlab graphical user interface. After a short review of the physical background and the underlying mathematical algorithm, the advantages and disadvantages/drawbacks are detailed.
AB - Increasing power density in power electronics applications requires optimum design of the cooling system. Finding the optimum design by manufacturing prototypes is often difficult, time consuming and expensive due to the large number of variable parameters. The choice of the optimal heat sink-fan combination can be assisted by a number of different numerical simulation methods. In a case study of a typical heat sink-fan combination in a welding machine, a comparison is presented between a full CFD-simulation and an optimization routine, embedded in a Matlab graphical user interface. After a short review of the physical background and the underlying mathematical algorithm, the advantages and disadvantages/drawbacks are detailed.
UR - http://www.scopus.com/inward/record.url?scp=79957889671&partnerID=8YFLogxK
U2 - 10.1109/ESIME.2011.5765813
DO - 10.1109/ESIME.2011.5765813
M3 - Conference contribution
SN - 9781457701078
T3 - 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011
BT - 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011
T2 - 12 th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro/Nanoelectronics and Systems
Y2 - 18 April 2011 through 20 April 2011
ER -