3D-Analysis of Bending-Type Ultrasonic Transducers for Distance Measurement Applications

Publikation: Beitrag in Buch/Bericht/Tagungsband › Konferenzbeitrag

Originalsprache	Englisch
Titel	Proceedings IEEE International Ultrasonics Symposium 2011
Herausgeber (Verlag)	IEEE
Seitenumfang	4
Publikationsstatus	Veröffentlicht - 2011
Veranstaltung	IEEE International Ultrasonics Symposium 2011 - Orlando, Florida, USA/Vereinigte Staaten Dauer: 18 Okt. 2011 → 21 Okt. 2011

Konferenz	IEEE International Ultrasonics Symposium 2011
Land/Gebiet	USA/Vereinigte Staaten
Ort	Orlando, Florida
Zeitraum	18.10.2011 → 21.10.2011

Zitieren

@inproceedings{f69981737187409cbc9d888467edfb50,

title = "3D-Analysis of Bending-Type Ultrasonic Transducers for Distance Measurement Applications",

author = "Mario Jungwirth and Michael Rabl and Manfred Kaltenbacher and Stefan Rupitsch",

year = "2011",

language = "English",

booktitle = "Proceedings IEEE International Ultrasonics Symposium 2011",

publisher = "IEEE",

note = "IEEE International Ultrasonics Symposium 2011 ; Conference date: 18-10-2011 Through 21-10-2011",

}

TY - GEN

T1 - 3D-Analysis of Bending-Type Ultrasonic Transducers for Distance Measurement Applications

AU - Jungwirth, Mario

AU - Rabl, Michael

AU - Kaltenbacher, Manfred

AU - Rupitsch, Stefan

PY - 2011

Y1 - 2011

M3 - Conference contribution

BT - Proceedings IEEE International Ultrasonics Symposium 2011

PB - IEEE

T2 - IEEE International Ultrasonics Symposium 2011

Y2 - 18 October 2011 through 21 October 2011

ER -