TY - GEN
T1 - 3D-analysis of bending-type transducers for distance measurement applications
AU - Jungwirth, Mario
AU - Kaltenbacher, Manfred
AU - Rabl, Michael
AU - Rupitsch, Stefan J.
PY - 2011
Y1 - 2011
N2 - Ultrasonic sensors are commonly utilized for a wide variety of non-contact presence, proximity or distance measuring applications in industry, especially the automotive branch. This paper shows how the radiation properties of bending-type ultrasonic transducers depend on shape, dimensions and material parameters. In order to determine their dependencies, the behavior of such transducers with regard to their emitting characteristics in air is simulated using the finite element (FE) method. Therewith, the electrical impedance as well as the surface elongation together with the radiated ultrasound is computed. For performing reliable simulations, we utilize a mathematical inverse method (IM) to identify the material parameters. The results of the FE simulations have been validated by laser doppler velocimetry (LDV) and acoustic pressure measurements.
AB - Ultrasonic sensors are commonly utilized for a wide variety of non-contact presence, proximity or distance measuring applications in industry, especially the automotive branch. This paper shows how the radiation properties of bending-type ultrasonic transducers depend on shape, dimensions and material parameters. In order to determine their dependencies, the behavior of such transducers with regard to their emitting characteristics in air is simulated using the finite element (FE) method. Therewith, the electrical impedance as well as the surface elongation together with the radiated ultrasound is computed. For performing reliable simulations, we utilize a mathematical inverse method (IM) to identify the material parameters. The results of the FE simulations have been validated by laser doppler velocimetry (LDV) and acoustic pressure measurements.
UR - https://www.scopus.com/pages/publications/84869064324
U2 - 10.1109/ULTSYM.2011.0388
DO - 10.1109/ULTSYM.2011.0388
M3 - Conference contribution
AN - SCOPUS:84869064324
SN - 9781457712531
T3 - IEEE International Ultrasonics Symposium, IUS
SP - 1563
EP - 1566
BT - 2011 IEEE International Ultrasonics Symposium, IUS 2011
T2 - 2011 IEEE International Ultrasonics Symposium, IUS 2011
Y2 - 18 October 2011 through 21 October 2011
ER -